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AMD has unveiled its new stacked chip technology, dubbed High-Bandwidth Memory (HBM).
The tech uses stacked RAM chips that communicate through small holes, whilst also offering three times the performance of traditional GDDR5 that’s currently used in many GPUs.
Plus, HBM also reduces power consumption for users.
According to PCworld.com, AMD also poked fun at rival Nvidia during the launch reveal, stating that the company is ‘at least a year behind’ the new tech.
Joe Macri, chief technology officer at AMD, said: “Nvidia creates PowerPoints and talks in advance like they are the wonderful leader of everything.
“While they’re talking, we’re working.”
HBM may also allegedly be used in AMD’s upcoming high-end GPU Fiji, which is expected to be called the Radeon R9 390X.
The tech has a clock speed of up to 500MHz and a bandwidth of 100GB/s per stack. It also has a bus width of 1024-bit and a voltage of 1.3.
This news comes after slides were leaked allegedly showing details of the new X86 Zen 16 core processors from AMD, and after AMD revealed the specs of its Radeon R9 300 series graphics cards.
