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Intel is joining forces with Toshiba and Samsung to develop technologies that could more than halve semiconductor widths by 2016, according to reports
The firms aim to reduce the size to nearly ten nanometres (around ten millionths of a millimetre), Reuters quotes the Nikkei Daily as reporting.
Samsung, Toshiba and Intel plan to invite about ten other semiconductor-related firms to establish a consortium to pay for half the initial R&D, while Japan’s Ministry of Economy, Trade and Industry will reportedly provide the remaining $61.21 million.
According to the Nikkei, Toshiba and Samsung plan to use the technology to create NAND flash memory and other chips, while Intel will likely use it to develop faster microprocessors.
