Scientists at the Massachusetts Institute of Technology are researching a computer chips that are capable of self assembly.
According to PC World, the scientists are currently developing a manufacturing template that causes the polymers to automatically fall in place to create an integrated circuit. The goal is to allow manufacturers to reduce the costs involved in etching complex designs on smaller chips.
MIT has stated that the technique could be used soon and that some companies are already expressing an interest in the technique.
“We want to do something that people would want to be able to use,” said Professor of materials science and engineering at MIT, Caroline Ross.
Advertisement
Related Stories
- Boffins aim to do away with magnetic fields in next-gen hard drives Feb 8th 2012 at 5:08AM
- IBM boffins create 12-atom magnetic bit Jan 16th 2012 at 7:27AM
- Nokia unveils solar-powered phone research Jan 4th 2012 at 5:50AM
- Government pledges £158 million for high tech research Dec 2nd 2011 at 12:56PM
- TSMC bucks chip trend with 28nm wins Nov 25th 2011 at 5:59AM
- Imagination opens new UK R&D shop in Bristol Nov 24th 2011 at 7:37AM
- Boffins create lie-detector software Nov 24th 2011 at 6:31AM
- Google X 'skunkworks' revealed Nov 14th 2011 at 10:19PM
- GPS chip 'breakthrough' promises faster, better indoors locations Nov 3rd 2011 at 5:45AM
- Toshiba show off ultra high resolution display Oct 23rd 2011 at 11:25PM
Follow Follow this article if you would like to receive notifications of updates.





















Add a new comment
You need to be logged in to post comments. If you do not have an account then please register.
Comments
0 comments
There are no comments yet, be the first to add one!