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A rumour is circulating that Intel might be abandoning the model of replaceable or upgradable CPU’s, instead opting for integrated chipsets.
According to the Japanese site PC Watch, the Broadwell family of processors, which will follow the forthcoming Haswell family of third generation Core processors, will put an end to the socketed design of CPUs.
The evidence cited is that, instead of using the land-grid array (LGA) surface mount packages common to current models, Broadwell will use ball-grid array (BGA) packages – a different system which specifically requires that the processor is soldered directly to the motherboard. Visually, the LGA processors have the grid of pins that can be dropped in to a socket, while BGA has a grid of solder balls that sit on the underside and must be fixed in to place.
While in the past, Intel has used both methods, the evidence suggests that in future, the only way to repair or upgrade a processor will be to replace the motherboard.
Meanwhile, Semi Accurate reports that Intel has kept motherboard manufacturers in the dark as to its intentions.
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